Clean up spec file for packaging accepted/trunk/20120821.172538 submit/trunk/20120821.102557 tizen/20120530.1
authorYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 03:54:33 +0000 (11:54 +0800)
committerYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 03:54:33 +0000 (11:54 +0800)
commit39609b7134e36653a4ce793f1a01b23b28faf77f
treee9e8b5090dc03a7a4a46e84a13d326dcedc2a13b
parentd21033ed8bca37be1cb657b8140552ab0a5fa985
Clean up spec file for packaging
packaging/obexd.changes
packaging/obexd.spec