dt-bindings: iio: maxim_thermocouple: document new 'compatible' strings
authorAndrea Merello <andrea.merello@gmail.com>
Wed, 20 Nov 2019 14:47:56 +0000 (15:47 +0100)
committerJonathan Cameron <Jonathan.Cameron@huawei.com>
Sat, 23 Nov 2019 14:25:02 +0000 (14:25 +0000)
commit3922f930de9d83fab3dcdc432ac046d79583e430
tree1ad0657e59c45a4d2752021c3e14d900c7f99da4
parentd7f6a749f30bc2296e0d92553aa9f4daad7bcf1f
dt-bindings: iio: maxim_thermocouple: document new 'compatible' strings

Now the maxim_thermocouple has new, more specific, 'compatible' strings for
better distinguish the various supported chips.

This patch updates the DT bindings documentation accordingly

Cc: Hartmut Knaack <knaack.h@gmx.de>
Cc: Lars-Peter Clausen <lars@metafoo.de>
Cc: Peter Meerwald-Stadler <pmeerw@pmeerw.net>
Cc: Colin Ian King <colin.king@canonical.com>
Cc: Patrick Havelange <patrick.havelange@essensium.com>
Cc: Matt Weber <matthew.weber@rockwellcollins.com>
Cc: Matt Ranostay <matt.ranostay@konsulko.com>
Cc: Chuhong Yuan <hslester96@gmail.com>
Cc: Daniel Gomez <dagmcr@gmail.com>
Cc: linux-iio@vger.kernel.org
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Mark Rutland <mark.rutland@arm.com>
Cc: devicetree@vger.kernel.org
Signed-off-by: Andrea Merello <andrea.merello@gmail.com>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com>
Documentation/devicetree/bindings/iio/temperature/maxim_thermocouple.txt