Package version up to 3.1.1 65/315965/1 accepted/tizen_unified accepted/tizen_unified_dev tizen accepted/tizen/unified/20240820.163537 accepted/tizen/unified/dev/20240821.053402
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 7 Aug 2024 11:34:27 +0000 (20:34 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Mon, 12 Aug 2024 04:55:26 +0000 (13:55 +0900)
commit372a09bf09cc63fc96f77c17234627c394526565
tree52903c793da707491c9d93754a7abd699fd1cb9d
parent674e8213b28853dc4ef620e284a88e58d609ea0c
Package version up to 3.1.1

Change-Id: I71a62360e469ab88b60c8f8a32024a8bce870b08
packaging/hal-backend-tbm-exynos-tgm.spec