thermal: extend the cooling device API to include power information
authorJavi Merino <javi.merino@arm.com>
Thu, 26 Feb 2015 19:00:28 +0000 (19:00 +0000)
committerJoonyoung Shim <jy0922.shim@samsung.com>
Thu, 7 Jul 2016 05:32:02 +0000 (14:32 +0900)
commit3420e856992bf1a27f4e55d64d74fe9a8adf015f
tree832d4495ee444eab3a3734cebccc779b8000c014
parent117bd6ec2bd4dee18c5f83e6b742d174c2007be8
thermal: extend the cooling device API to include power information

Add three optional callbacks to the cooling device interface to allow
them to express power.  In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
[jy0922.shim: apply mainline patch]
Signed-off-by: Joonyoung Shim <jy0922.shim@samsung.com>
drivers/thermal/thermal_core.c
include/linux/thermal.h