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(parent: 49ea388) | patch
packaging: add rpm packaging spec 14/248914/5
authorSeung-Woo Kim <sw0312.kim@samsung.com>
Mon, 7 Dec 2020 01:54:27 +0000 (10:54 +0900)
committerSeung-Woo Kim <sw0312.kim@samsung.com>
Thu, 10 Dec 2020 07:36:43 +0000 (16:36 +0900)
commit2ecbfc7190aa4a1538b8f9cebb3517616f113d1b
tree798cbbb7907e9539b4abd8659467af71c6648c84tree | snapshot
parent49ea3888451546ddf9f2c63f6fab20e554940d59commit | diff
packaging: add rpm packaging spec

For Tizen packaging, add rpm packaging spec to build both odroid
and kvim boards.

Change-Id: I14815c8df90b6455bb1bd37b8111e9f206163040
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
.gbs.conf [new file with mode: 0644] blob
packaging/linux-amlogic.spec [new file with mode: 0644] blob
Domain: System / Kernel;