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common: specfile has unused subpackage 87/106487/2 accepted/tizen/3.0/common/20161222.181654 accepted/tizen/3.0/ivi/20161222.093505 accepted/tizen/3.0/mobile/20161222.093417 accepted/tizen/3.0/tv/20161222.093429 accepted/tizen/3.0/wearable/20161222.093451 submit/tizen_3.0/20161222.053422
authortaeyoung <ty317.kim@samsung.com>
Thu, 22 Dec 2016 01:41:35 +0000 (10:41 +0900)
committerTaeyoung Kim <ty317.kim@samsung.com>
Thu, 22 Dec 2016 05:05:43 +0000 (21:05 -0800)
commit24e9913467b3df746b9cee01ed34c41920b31bbb
tree8e10e8cb3a54ae72ce1fa295c2246ddd3bb1027btree | snapshot
parentaaa7e222416ffed4a3ba6616da77bec67ba68372commit | diff
common: specfile has unused subpackage

%package deviced in deviced.spec means
"deviced-deviced", which does not have %files entry,
which in turn, makes "deviced-deviced" not be created.
Because it is useless, it is removed
before further spec file modification.

Change-Id: I86ef4266776332f6bb65752487290d8405300842
Signed-off-by: taeyoung <ty317.kim@samsung.com>
packaging/deviced.spec diff | blob | history
Domain: System / System Framework;