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(parent: da07462) | patch
scripts: tizen: sd_fusing: Use only part type from block device for fusing
authorSeung-Woo Kim <sw0312.kim@samsung.com>
Tue, 30 Mar 2021 02:14:30 +0000 (11:14 +0900)
committerMarek Szyprowski <m.szyprowski@samsung.com>
Mon, 15 Nov 2021 10:37:12 +0000 (11:37 +0100)
commit1dfce32771c8295a1984b9766e26ca20432b51a0
tree98843134e0d2066681bed975feb753e9909f099ftree | snapshot
parentda07462dc84e3618b51a9c2fb94a12770770714acommit | diff
scripts: tizen: sd_fusing: Use only part type from block device for fusing

Current block device parsing result gives both disk and part
types of block device and this can break parsing 1st partition
for "mmcblk1" case. Use only part type from block device for
fusing when flashing partition image.

Change-Id: I0ca393fd5ecd26d77939f16c9c412d00d18cb912
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
scripts/tizen/sd_fusing_rpi3.sh diff | blob | history
Domain: System / Kernel;