packaging: Bump up to 0.10.0
authorjeon <jhyuni.kang@samsung.com>
Fri, 21 Feb 2020 05:33:10 +0000 (14:33 +0900)
committerduna.oh <duna.oh@samsung.com>
Mon, 20 Feb 2023 11:10:51 +0000 (20:10 +0900)
commit1b6ca484b9ba7a458626883a747311a3da206ea1
treeecc979db4b0f3188ca328d092ed7d0c59612ba70
parent999f1ac1dc160744a4bca82f38d9f6da3c5ed40d
packaging: Bump up to 0.10.0

Change-Id: Ie73df143cb587d8ad545cd7023bc0518c1546c85
packaging/libxkbcommon.spec