arm: omap5: add U-Boot FIT signing and SPL image post-processing
authorAndreas Dannenberg <dannenberg@ti.com>
Mon, 27 Jun 2016 14:19:22 +0000 (09:19 -0500)
committerTom Rini <trini@konsulko.com>
Thu, 14 Jul 2016 22:22:22 +0000 (18:22 -0400)
commit17c298733612f68ebf7702f28f32ad78c7ef115e
tree11d0ef07ab235123bab4b0a4ee8b7abe13451609
parentda74d1f341e46ecc0ae893b4aa3b771ce9dba9f3
arm: omap5: add U-Boot FIT signing and SPL image post-processing

Modify the SPL build procedure for AM57xx and DRA7xx high-security (HS)
device variants to create a secure u-boot_HS.img FIT blob that contains
U-Boot and DTB artifacts signed with a TI-specific process based on the
CONFIG_TI_SECURE_DEVICE config option and the externally-provided image
signing tool.

Also populate the corresponding FIT image post processing call to be
performed during SPL runtime.

Signed-off-by: Daniel Allred <d-allred@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Tom Rini <trini@konsulko.com>
arch/arm/cpu/armv7/omap5/config.mk
board/ti/am57xx/board.c
board/ti/dra7xx/evm.c
configs/am57xx_hs_evm_defconfig
configs/dra7xx_hs_evm_defconfig