packaging: Made build scripts for GBS.
authorJaechul Lee <jcsing.lee@samsung.com>
Thu, 26 Jan 2017 01:13:24 +0000 (10:13 +0900)
committerJaechul Lee <jcsing.lee@samsung.com>
Tue, 14 Feb 2017 04:26:30 +0000 (13:26 +0900)
commit0edcfcdef501cee338f973a3c5f23feaeb3b24e3
tree3a3dffb25aade26ea0733ab50b97d1e8919648d8
parentb793841fc0c860f8868094930bee59c8d0d83bfa
packaging: Made build scripts for GBS.

Build scripts were fixed to be worked on GBS environment based on gcc6.

Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
packaging/linux-3.18-exynos7270.spec
release_obs.sh