bump up v0.1.2 47/257047/1 submit/tizen/20210419.023500
authorHermet Park <chuneon.park@samsung.com>
Mon, 19 Apr 2021 01:48:56 +0000 (10:48 +0900)
committerHermet Park <chuneon.park@samsung.com>
Mon, 19 Apr 2021 01:48:56 +0000 (10:48 +0900)
commit05090488efc1fea4d1cd315adfca1df36e631b24
tree6e5af11855f6cc7499eb595684d8ff62b5acb0f7
parentbb472459c99847e9742a8cf7bc1a14a6b58a444e
bump up v0.1.2

Change-Id: Ia3f1dddf6c27fbe3894df637f15d8d9b55f7710c
packaging/thorvg.spec