packaging: Bump version to 2.40
authorDongkyun Son <dongkyun.s@samsung.com>
Thu, 26 Jan 2023 08:57:09 +0000 (17:57 +0900)
committerDongkyun Son <dongkyun.s@samsung.com>
Wed, 3 May 2023 10:43:53 +0000 (19:43 +0900)
commit04eaec5af9d51e7290a9db215c76af04492dae88
tree98c386d830402f9610b197f59502a971d578ba04
parent3696bc9bf3d00fed55be1132620afbb98ac73581
packaging: Bump version to 2.40

Change-Id: I0ed6c5efe6da862c633c55197f5b49994b36f648
Signed-off-by: Dongkyun Son <dongkyun.s@samsung.com>
packaging/binutils-aarch64.spec
packaging/binutils-armv7hl.spec
packaging/binutils-armv7l.spec
packaging/binutils.spec