packaging: bump version to 0.21.0 90/271190/2
authorAdrian Szyndela <adrian.s@samsung.com>
Wed, 16 Feb 2022 22:02:34 +0000 (23:02 +0100)
committerAdrian Szyndela <adrian.s@samsung.com>
Thu, 17 Feb 2022 07:37:01 +0000 (08:37 +0100)
commit046aac400387511d98643a5bd9ceef2ccd036371
treee5677284867f7a84e7642950aa7cf52a126fb4e7
parentd682576188dc6c86dab38b80dab917b6d50f78ba
packaging: bump version to 0.21.0

Change-Id: I40efa640a63c6ff91d56ac5f2e6ce42879ae4a55
packaging/bcc-tools.spec