packaging: bump to 8.3.1 accepted/tizen/unified/20200107.043427 submit/tizen/20200106.094039
authorSungguk Na <sungguk.na@samsung.com>
Fri, 27 Dec 2019 05:28:25 +0000 (14:28 +0900)
committerSungguk Na <sungguk.na@samsung.com>
Fri, 27 Dec 2019 05:28:25 +0000 (14:28 +0900)
commit0370642f333a3977a50b3aa4d498f60756218cb7
tree528452f6d1f252be9251921df1433a037874b4e1
parentf55c1447711682ac540cd169244e03e4fb870b48
packaging: bump to 8.3.1

Change-Id: I70f646d77ad2d283e874ab4251ece9bc3c8f6fd9
Signed-off-by: Sungguk Na <sungguk.na@samsung.com>
packaging/gdb.spec