Merge "Modify the logic of bonding with LE type" into tizen
authorPyun DoHyun <dh79.pyun@samsung.com>
Tue, 28 Jan 2020 06:03:12 +0000 (06:03 +0000)
committerGerrit Code Review <gerrit@review.ap-northeast-2.compute.internal>
Tue, 28 Jan 2020 06:03:12 +0000 (06:03 +0000)
commit00cdee1efebd9e5873a7752ffc1b46dcf3760b53
tree730b8c000b8d019c0266ccc2e25428bc51bce18d
parente7bb2f799f04a8f3a14665fee2de12fade1657b6
parent064713fba7d1d7c8f2d602ea91f31f5aed3b6d1b
Merge "Modify the logic of bonding with LE type" into tizen