X-Git-Url: http://review.tizen.org/git/?a=blobdiff_plain;f=packaging%2Flsb.changes;h=8ac6fd9358a9632c97112b9537824e4f0de7c6fa;hb=HEAD;hp=90e391870c18a8a511afc1efc924bde05cac0fe4;hpb=a4c2c4f9d0a33caff9a73fcf8c8934fdf75d705a;p=platform%2Fupstream%2Flsb.git

diff --git a/packaging/lsb.changes b/packaging/lsb.changes
index 90e3918..8ac6fd9 100644
--- a/packaging/lsb.changes
+++ b/packaging/lsb.changes
@@ -1,3 +1,9 @@
+* Mon Oct 28 2013 Jacek Bukarewicz <j.bukarewicz@samsung.com> accepted/tizen/20130912.195400@34652e3
+- Fixes to rpmlint and license related issues
+
+* Sun Aug 25 2013 Chengwei Yang <chengwei.yang@intel.com>
+- Remove debian packaging stuff
+
 * Sun Aug 25 2013 Chengwei Yang <chengwei.yang@intel.com> accepted/tizen/20130710.215545@b6a97b3
 - resetting manifest requested domain to floor
 - Tizen 2.1 base