X-Git-Url: http://review.tizen.org/git/?a=blobdiff_plain;f=packaging%2Flsb.changes;h=8ac6fd9358a9632c97112b9537824e4f0de7c6fa;hb=9ebc2a72f93cbeddc238aa66d4c0b87c5448866b;hp=bd9380c68d7a9ee8f59cd899ca1d4e9279e2fd83;hpb=af84e0f58328f496990ff783e2bb2c971224e5b4;p=platform%2Fupstream%2Flsb.git

diff --git a/packaging/lsb.changes b/packaging/lsb.changes
index bd9380c..8ac6fd9 100644
--- a/packaging/lsb.changes
+++ b/packaging/lsb.changes
@@ -1,3 +1,6 @@
+* Mon Oct 28 2013 Jacek Bukarewicz <j.bukarewicz@samsung.com> accepted/tizen/20130912.195400@34652e3
+- Fixes to rpmlint and license related issues
+
 * Sun Aug 25 2013 Chengwei Yang <chengwei.yang@intel.com>
 - Remove debian packaging stuff