1 # SPDX-License-Identifier: GPL-2.0-only
3 # Generic thermal drivers configuration
9 Thermal drivers offer a generic mechanism for
10 thermal management. Usually it's made up of one or more thermal
11 zones and cooling devices.
12 Each thermal zone contains its own temperature, trip points,
14 All platforms with ACPI or Open Firmware thermal support can use
16 If you want this support, you should say Y here.
20 config THERMAL_NETLINK
21 bool "Thermal netlink management"
24 The thermal framework has a netlink interface to do thermal
25 zones discovery, temperature readings and events such as
26 trip point crossed, cooling device update or governor
27 change. It is recommended to enable the feature.
29 config THERMAL_STATISTICS
30 bool "Thermal state transition statistics"
32 Export thermal state transition statistics information through sysfs.
36 config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
37 int "Emergency poweroff delay in milli-seconds"
40 Thermal subsystem will issue a graceful shutdown when
41 critical temperatures are reached using orderly_poweroff(). In
42 case of failure of an orderly_poweroff(), the thermal emergency
43 poweroff kicks in after a delay has elapsed and shuts down the system.
44 This config is number of milliseconds to delay before emergency
45 poweroff kicks in. Similarly to the critical trip point,
46 the delay should be carefully profiled so as to give adequate
47 time for orderly_poweroff() to finish on regular execution.
48 If set to 0 emergency poweroff will not be supported.
54 prompt "Expose thermal sensors as hwmon device"
55 depends on HWMON=y || HWMON=THERMAL
58 In case a sensor is registered with the thermal
59 framework, this option will also register it
60 as a hwmon. The sensor will then have the common
61 hwmon sysfs interface.
63 Say 'Y' here if you want all thermal sensors to
64 have hwmon sysfs interface too.
68 prompt "APIs to parse thermal data out of device tree"
72 This options provides helpers to add the support to
73 read and parse thermal data definitions out of the
76 Say 'Y' here if you need to build thermal infrastructure
83 config THERMAL_WRITABLE_TRIPS
84 bool "Enable writable trip points"
86 This option allows the system integrator to choose whether
87 trip temperatures can be changed from userspace. The
88 writable trips need to be specified when setting up the
89 thermal zone but the choice here takes precedence.
91 Say 'Y' here if you would like to allow userspace tools to
92 change trip temperatures.
95 prompt "Default Thermal governor"
96 default THERMAL_DEFAULT_GOV_STEP_WISE
98 This option sets which thermal governor shall be loaded at
99 startup. If in doubt, select 'step_wise'.
101 config THERMAL_DEFAULT_GOV_STEP_WISE
103 select THERMAL_GOV_STEP_WISE
105 Use the step_wise governor as default. This throttles the
106 devices one step at a time.
108 config THERMAL_DEFAULT_GOV_FAIR_SHARE
110 select THERMAL_GOV_FAIR_SHARE
112 Use the fair_share governor as default. This throttles the
113 devices based on their 'contribution' to a zone. The
114 contribution should be provided through platform data.
116 config THERMAL_DEFAULT_GOV_USER_SPACE
118 select THERMAL_GOV_USER_SPACE
120 The Userspace governor allows to get trip point crossed
121 notification from the kernel via uevents. It is recommended
122 to use the netlink interface instead which gives richer
123 information about the thermal framework events.
125 config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
126 bool "power_allocator"
127 depends on THERMAL_GOV_POWER_ALLOCATOR
129 Select this if you want to control temperature based on
130 system and device power allocation. This governor can only
131 operate on cooling devices that implement the power API.
133 config THERMAL_DEFAULT_GOV_BANG_BANG
135 depends on THERMAL_GOV_BANG_BANG
137 Use the bang_bang governor as default. This throttles the
138 devices one step at the time, taking into account the trip
143 config THERMAL_GOV_FAIR_SHARE
144 bool "Fair-share thermal governor"
146 Enable this to manage platform thermals using fair-share governor.
148 config THERMAL_GOV_STEP_WISE
149 bool "Step_wise thermal governor"
151 Enable this to manage platform thermals using a simple linear
154 config THERMAL_GOV_BANG_BANG
155 bool "Bang Bang thermal governor"
158 Enable this to manage platform thermals using bang bang governor.
160 Say 'Y' here if you want to use two point temperature regulation
161 used for fans without throttling. Some fan drivers depend on this
162 governor to be enabled (e.g. acerhdf).
164 config THERMAL_GOV_USER_SPACE
165 bool "User_space thermal governor"
167 Enable this to let the user space manage the platform thermals.
169 config THERMAL_GOV_POWER_ALLOCATOR
170 bool "Power allocator thermal governor"
171 depends on ENERGY_MODEL
173 Enable this to manage platform thermals by dynamically
174 allocating and limiting power to devices.
177 bool "Generic cpu cooling support"
178 depends on THERMAL_OF
180 Enable the CPU cooling features. If the system has no active
181 cooling device available, this option allows to use the CPU
186 config CPU_FREQ_THERMAL
187 bool "CPU frequency cooling device"
191 This implements the generic cpu cooling mechanism through frequency
192 reduction. An ACPI version of this already exists
193 (drivers/acpi/processor_thermal.c).
194 This will be useful for platforms using the generic thermal interface
195 and not the ACPI interface.
197 config CPU_IDLE_THERMAL
198 bool "CPU idle cooling device"
199 depends on IDLE_INJECT
201 This implements the CPU cooling mechanism through
202 idle injection. This will throttle the CPU by injecting
206 config DEVFREQ_THERMAL
207 bool "Generic device cooling support"
208 depends on PM_DEVFREQ
211 This implements the generic devfreq cooling mechanism through
212 frequency reduction for devices using devfreq.
214 This will throttle the device by limiting the maximum allowed DVFS
215 frequency corresponding to the cooling level.
217 In order to use the power extensions of the cooling device,
218 devfreq should use the simple_ondemand governor.
220 If you want this support, you should say Y here.
222 config THERMAL_EMULATION
223 bool "Thermal emulation mode support"
225 Enable this option to make a emul_temp sysfs node in thermal zone
226 directory to support temperature emulation. With emulation sysfs node,
227 user can manually input temperature and test the different trip
228 threshold behaviour for simulation purpose.
230 WARNING: Be careful while enabling this option on production systems,
231 because userland can easily disable the thermal policy by simply
232 flooding this sysfs node with low temperature values.
235 tristate "Generic Thermal MMIO driver"
239 This option enables the generic thermal MMIO driver that will use
240 memory-mapped reads to get the temperature. Any HW/System that
241 allows temperature reading by a single memory-mapped reading, be it
242 register or shared memory, is a potential candidate to work with this
246 tristate "Hisilicon thermal driver"
247 depends on ARCH_HISI || COMPILE_TEST
252 Enable this to plug hisilicon's thermal sensor driver into the Linux
253 thermal framework. cpufreq is used as the cooling device to throttle
254 CPUs when the passive trip is crossed.
257 tristate "Temperature sensor driver for Freescale i.MX SoCs"
258 depends on ARCH_MXC || COMPILE_TEST
259 depends on NVMEM || !NVMEM
260 depends on MFD_SYSCON
263 Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
264 It supports one critical trip point and one passive trip point. The
265 cpufreq is used as the cooling device to throttle CPUs when the
266 passive trip is crossed.
268 config IMX_SC_THERMAL
269 tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
273 Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
274 system controller inside, Linux kernel has to communicate with system
275 controller via MU (message unit) IPC to get temperature from thermal
276 sensor. It supports one critical trip point and one
277 passive trip point for each thermal sensor.
279 config IMX8MM_THERMAL
280 tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
281 depends on ARCH_MXC || COMPILE_TEST
284 Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
285 It supports one critical trip point and one passive trip point. The
286 cpufreq is used as the cooling device to throttle CPUs when the passive
290 tristate "Texas Instruments K3 thermal support"
291 depends on ARCH_K3 || COMPILE_TEST
293 If you say yes here you get thermal support for the Texas Instruments
294 K3 SoC family. The current chip supported is:
297 This includes temperature reading functionality.
299 config MAX77620_THERMAL
300 tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
301 depends on MFD_MAX77620
304 Support for die junction temperature warning alarm for Maxim
305 Semiconductor PMIC MAX77620 device. Device generates two alarm
306 interrupts when PMIC die temperature cross the threshold of
307 120 degC and 140 degC.
310 tristate "QorIQ Thermal Monitoring Unit"
311 depends on THERMAL_OF && HAS_IOMEM
312 depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
315 Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
316 It supports one critical trip point and one passive trip point. The
317 cpufreq is used as the cooling device to throttle CPUs when the
318 passive trip is crossed.
321 tristate "SPEAr thermal sensor driver"
322 depends on PLAT_SPEAR || COMPILE_TEST
326 Enable this to plug the SPEAr thermal sensor driver into the Linux
330 tristate "Allwinner sun8i thermal driver"
331 depends on ARCH_SUNXI || COMPILE_TEST
335 depends on RESET_CONTROLLER
337 Support for the sun8i thermal sensor driver into the Linux thermal
340 To compile this driver as a module, choose M here: the
341 module will be called sun8i-thermal.
343 config ROCKCHIP_THERMAL
344 tristate "Rockchip thermal driver"
345 depends on ARCH_ROCKCHIP || COMPILE_TEST
346 depends on RESET_CONTROLLER
349 Rockchip thermal driver provides support for Temperature sensor
350 ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
351 trip point. Cpufreq is used as the cooling device and will throttle
352 CPUs when the Temperature crosses the passive trip point.
355 tristate "Renesas R-Car thermal driver"
356 depends on ARCH_RENESAS || COMPILE_TEST
359 Enable this to plug the R-Car thermal sensor driver into the Linux
362 config RCAR_GEN3_THERMAL
363 tristate "Renesas R-Car Gen3 and RZ/G2 thermal driver"
364 depends on ARCH_RENESAS || COMPILE_TEST
368 Enable this to plug the R-Car Gen3 or RZ/G2 thermal sensor driver into
369 the Linux thermal framework.
372 tristate "Renesas RZ/G2L thermal driver"
373 depends on ARCH_RENESAS || COMPILE_TEST
377 Enable this to plug the RZ/G2L thermal sensor driver into the Linux
380 config KIRKWOOD_THERMAL
381 tristate "Temperature sensor on Marvell Kirkwood SoCs"
382 depends on MACH_KIRKWOOD || COMPILE_TEST
386 Support for the Kirkwood thermal sensor driver into the Linux thermal
387 framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
390 tristate "Temperature sensor on Marvell Dove SoCs"
391 depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
395 Support for the Dove thermal sensor driver in the Linux thermal
398 config DB8500_THERMAL
399 tristate "DB8500 thermal management"
400 depends on MFD_DB8500_PRCMU && OF
403 Adds DB8500 thermal management implementation according to the thermal
404 management framework. A thermal zone with several trip points will be
405 created. Cooling devices can be bound to the trip points to cool this
406 thermal zone if trip points reached.
408 config ARMADA_THERMAL
409 tristate "Marvell EBU Armada SoCs thermal management"
410 depends on ARCH_MVEBU || COMPILE_TEST
414 Enable this option if you want to have support for thermal management
415 controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
417 config DA9062_THERMAL
418 tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
419 depends on MFD_DA9062 || COMPILE_TEST
422 Enable this for the Dialog Semiconductor thermal sensor driver.
423 This will report PMIC junction over-temperature for one thermal trip
425 Compatible with the DA9062 and DA9061 PMICs.
427 menu "Mediatek thermal drivers"
428 depends on ARCH_MEDIATEK || COMPILE_TEST
429 source "drivers/thermal/mediatek/Kconfig"
432 config AMLOGIC_THERMAL
433 tristate "Amlogic Thermal Support"
435 depends on OF && ARCH_MESON
437 If you say yes here you get support for Amlogic Thermal
440 This driver can also be built as a module. If so, the module will
441 be called amlogic_thermal.
443 menu "Intel thermal drivers"
444 depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
445 source "drivers/thermal/intel/Kconfig"
448 menu "Broadcom thermal drivers"
449 depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
451 source "drivers/thermal/broadcom/Kconfig"
454 menu "Texas Instruments thermal drivers"
455 depends on ARCH_HAS_BANDGAP || COMPILE_TEST
457 source "drivers/thermal/ti-soc-thermal/Kconfig"
460 menu "Samsung thermal drivers"
461 depends on ARCH_EXYNOS || COMPILE_TEST
462 source "drivers/thermal/samsung/Kconfig"
465 menu "STMicroelectronics thermal drivers"
466 depends on (ARCH_STI || ARCH_STM32) && OF
467 source "drivers/thermal/st/Kconfig"
470 source "drivers/thermal/tegra/Kconfig"
472 config GENERIC_ADC_THERMAL
473 tristate "Generic ADC based thermal sensor"
476 This enabled a thermal sysfs driver for the temperature sensor
477 which is connected to the General Purpose ADC. The ADC channel
478 is read via IIO framework and the channel information is provided
479 to this driver. This driver reports the temperature by reading ADC
480 channel and converts it to temperature based on lookup table.
482 menu "Qualcomm thermal drivers"
483 depends on (ARCH_QCOM && OF) || COMPILE_TEST
484 source "drivers/thermal/qcom/Kconfig"
487 config UNIPHIER_THERMAL
488 tristate "Socionext UniPhier thermal driver"
489 depends on ARCH_UNIPHIER || COMPILE_TEST
490 depends on THERMAL_OF && MFD_SYSCON
492 Enable this to plug in UniPhier on-chip PVT thermal driver into the
493 thermal framework. The driver supports CPU thermal zone temperature
494 reporting and a couple of trip points.
497 tristate "Temperature sensor on Spreadtrum SoCs"
498 depends on ARCH_SPRD || COMPILE_TEST
500 Support for the Spreadtrum thermal sensor driver in the Linux thermal
503 config KHADAS_MCU_FAN_THERMAL
504 tristate "Khadas MCU controller FAN cooling support"
506 depends on MFD_KHADAS_MCU
510 If you say yes here you get support for the FAN controlled
511 by the Microcontroller found on the Khadas VIM boards.
513 config LOONGSON2_THERMAL
514 tristate "Loongson-2 SoC series thermal driver"
515 depends on LOONGARCH || COMPILE_TEST
518 Support for Thermal driver found on Loongson-2 SoC series platforms.
519 The thermal driver realizes get_temp and set_trips function, which
520 are used to obtain the temperature of the current node and set the
521 temperature range to trigger the interrupt. When the input temperature
522 is higher than the high temperature threshold or lower than the low
523 temperature threshold, the interrupt will occur.