1 # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
4 $id: http://devicetree.org/schemas/vendor-prefixes.yaml#
5 $schema: http://devicetree.org/meta-schemas/core.yaml#
7 title: Devicetree Vendor Prefix Registry
10 - Rob Herring <robh@kernel.org>
17 # Prefixes which are not vendors, but followed the pattern
18 # DO NOT ADD NEW PROPERTIES TO THIS LIST
19 "^(at25|devbus|dmacap|dsa|exynos|fsi[ab]|gpio-fan|gpio|gpmc|hdmi|i2c-gpio),.*": true
20 "^(keypad|m25p|max8952|max8997|max8998|mpmc),.*": true
21 "^(pinctrl-single|#pinctrl-single|PowerPC),.*": true
22 "^(pl022|pxa-mmc|rcar_sound|rotary-encoder|s5m8767|sdhci),.*": true
23 "^(simple-audio-card|simple-graph-card|st-plgpio|st-spics|ts),.*": true
25 # Keep list in alphabetical order.
27 description: Abilis Systems
29 description: Abracon Corporation
31 description: Acme Systems srl
33 description: Actions Semiconductor Co., Ltd.
35 description: Active-Semi International Inc
37 description: Avionic Design GmbH
39 description: Adafruit Industries, LLC
41 description: Adapteva, Inc.
43 description: Adaptrum, Inc.
45 description: AD Holdings Plc.
47 description: Analog Devices, Inc.
49 description: Advantech Corporation
50 "^aeroflexgaisler,.*":
51 description: Aeroflex Gaisler AB
53 description: Annapurna Labs
55 description: Allegro DVT
59 description: Allwinner Technology Co., Ltd.
61 description: AlphaScale Integrated Circuits Systems, Inc.
63 description: Altera Corp.
65 description: Amarula Solutions
67 description: Amazon.com, Inc.
69 description: Applied Micro Circuits Corporation (APM, formally AMCC)
71 description: Advanced Micro Devices (AMD), Inc.
73 description: Shenzhen Amediatech Technology Co., Ltd
75 description: Amlogic, Inc.
77 description: Ampire Co., Ltd.
81 description: AMS-Taos Inc.
83 description: Analogix Semiconductor, Inc.
85 description: Andes Technology Corporation
87 description: Anvo-Systems Dresden GmbH
89 description: Applied Micro Circuits Corporation (APM)
91 description: Aptina Imaging
93 description: Arasan Chip Systems
95 description: ArcherMind Technology (Nanjing) Co., Ltd.
97 description: Arctic Sand
99 description: arcx Inc. / Archronix Inc.
101 description: Aries Embedded GmbH
103 description: ARM Ltd.
105 description: ARMadeus Systems SARL
107 description: Arrow Electronics
109 description: Artesyn Embedded Technologies Inc.
111 description: Asahi Kasei Corp.
113 description: ASPEED Technology Inc.
115 description: AsusTek Computer Inc.
117 description: Atlas Scientific LLC
119 description: Atmel Corporation
121 description: AU Optronics Corporation
123 description: Auvidea GmbH
125 description: Avago Technologies
127 description: avia semiconductor
129 description: Shanghai AVIC Optoelectronics Co., Ltd.
131 description: Avnet, Inc.
133 description: Axentia Technologies AB
135 description: Axis Communications AB
137 description: Azoteq (Pty) Ltd
139 description: Shenzhen AZW Technology Co., Ltd.
141 description: BIPAI KEJI LIMITED
143 description: Beckhoff Automation GmbH & Co. KG
145 description: Bitmain Technologies
147 description: BOE Technology Group Co., Ltd.
149 description: Bosch Sensortec GmbH
151 description: Boundary Devices Inc.
153 description: Broadcom Corporation
155 description: Buffalo, Inc.
157 description: B&R Industrial Automation GmbH
159 description: Bticino International
163 description: Capella Microsystems, Inc
165 description: Cascoda, Ltd.
167 description: Catalyst Semiconductor, Inc.
169 description: Cavium, Inc.
171 description: Cadence Design Systems Inc.
173 description: CDTech(H.K.) Electronics Limited
175 description: Ceva, Inc.
177 description: Chipidea, Inc
181 description: ChipSPARK
183 description: Common Hardware Reference Platform
185 description: Chunghwa Picture Tubes Ltd.
187 description: Chuwi Innovation Ltd.
189 description: Computadora Industrial Abierta Argentina
191 description: Cirrus Logic, Inc.
193 description: Cloud Engines, Inc.
195 description: Chips&Media, Inc.
197 description: Conexant Systems, Inc.
199 description: Colorful GRP, Shenzhen Xueyushi Technology Ltd.
201 description: CompuLab Ltd.
203 description: Chengdu Corpro Technology Co., Ltd.
205 description: Cortina Systems, Inc.
207 description: Cosmic Circuits
209 description: Crane Connectivity Solutions
211 description: Creative Technology Ltd
213 description: Crystalfontz America, Inc.
215 description: Hangzhou C-SKY Microsystems Co., Ltd
217 description: Shenzen Chuangsiqi Technology Co.,Ltd.
219 description: Cubietech, Ltd.
221 description: Cypress Semiconductor Corporation
223 description: CZ.NIC, z.s.p.o.
225 description: Maxim Integrated Products (formerly Dallas Semiconductor)
227 description: DataImage, Inc.
229 description: DAVICOM Semiconductor, Inc.
231 description: Delta Electronics, Inc.
233 description: Denx Software Engineering
235 description: Devantech, Ltd.
237 description: DH electronics GmbH
239 description: Shenzhen Yagu Electronic Technology Co., Ltd.
241 description: Digi International Inc.
243 description: Diglent, Inc.
245 description: Dioo Microcircuit Co., Ltd
247 description: DLC Display Co., Ltd.
249 description: Dialog Semiconductor
251 description: D-Link Corporation
253 description: Data Modul AG
255 description: Domintech Co., Ltd.
257 description: Dongwoon Anatech
259 description: DPTechnics
261 description: Dragino Technology Co., Limited
263 description: dServe Technology B.V.
265 description: Embedded Artists AB
267 description: EBS-SYSTART GmbH
269 description: EBV Elektronik
271 description: Eckelmann AG
273 description: Emerging Display Technologies
275 description: eGalax_eMPIA Technology Inc
277 description: Einfochips
279 description: Elan Microelectronic Corp.
281 description: Elgin S/A.
283 description: Shenzhen Embest Technology Co., Ltd.
285 description: Emlid, Ltd.
287 description: EM Microelectronic
288 "^empire-electronix,.*":
289 description: Empire Electronix
291 description: emtrion GmbH
293 description: Endless Mobile, Inc.
295 description: Silicon Laboratories (formerly Energy Micro AS)
297 description: Engicam S.r.l.
299 description: EPCOS AG
301 description: Ecole Polytechnique Fédérale de Lausanne
303 description: Seiko Epson Corp.
305 description: Espressif Systems Co. Ltd.
307 description: ESTeem Wireless Modems
309 description: NI Ettus Research
311 description: Eukréa Electromatique
313 description: Everest Semiconductor Co. Ltd.
315 description: Everspin Technologies, Inc.
317 description: Evervision Electronics Co. Ltd.
319 description: Exar Corporation
323 description: EZchip Semiconductor
325 description: Facebook
327 description: Fairphone B.V.
329 description: Faraday Technology Corporation
331 description: Fastrax Oy
333 description: Fairchild Semiconductor
335 description: Shenzhen Feixin Photoelectic Co., Ltd
337 description: Shenzhen Fly Young Technology Co.,LTD.
341 description: FocalTech Systems Co.,Ltd
343 description: Shenzhen Frida LCD Co., Ltd.
345 description: Guangzhou FriendlyARM Computer Tech Co., Ltd
347 description: Freescale Semiconductor
349 description: Fujitsu Ltd.
351 description: GARDENA GmbH
353 description: Gateworks Corporation
355 description: Game Consoles Worldwide
357 description: General Electric Company
359 description: GeekBuying
361 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
363 description: GE Fanuc Intelligent Platforms Embedded Systems, Inc.
365 description: Gemei Digital Technology Co., Ltd.
367 description: Geniatech, Inc.
369 description: Giantec Semiconductor, Inc.
371 description: Giantplus Technology Co., Ltd.
373 description: Globalscale Technologies, Inc.
375 description: GlobalTop Technology, Inc.
377 description: Global Mixed-mode Technology, Inc.
379 description: Shenzhen Huiding Technology Co., Ltd.
381 description: Google, Inc.
385 description: Garmin Limited
387 description: Gumstix, Inc.
389 description: Gateworks Corporation
391 description: HannStar Display Corporation
393 description: Haoyu Microelectronic Co. Ltd.
395 description: Hardkernel Co., Ltd
397 description: HiDeep Inc.
399 description: Himax Technologies, Inc.
401 description: Hisilicon Limited.
403 description: Hitachi Ltd.
405 description: Hitex Development Tools
407 description: Holt Integrated Circuits, Inc.
409 description: Honeywell
411 description: Jiangsu HopeRun Software Co., Ltd.
413 description: Hewlett Packard
415 description: HannStar Display Co.
417 description: Holtek Semiconductor, Inc.
419 description: Shenzhen Hugsun Technology Co. Ltd.
421 description: HwaCom Systems Inc.
423 description: Hyundai Technology
425 description: I2SE GmbH
427 description: International Business Machines (IBM)
429 description: IC Plus Corp.
431 description: Integrated Device Technologies, Inc.
433 description: Ingenieurburo Fur Ic-Technologie (I/F/I)
435 description: ILI Technology Corporation (ILITEK)
437 description: Imagination Technologies Ltd.
439 description: In-Circuit GmbH
441 description: Shenzhen iNet Mobile Internet Technology Co., Ltd
443 description: Infineon Technologies
445 description: Inforce Computing
447 description: Ingenic Semiconductor
449 description: Innolux Corporation
451 description: INSIDE Secure
453 description: Inspur Corporation
455 description: Intel Corporation
457 description: Inter Control Group
459 description: InvenSense Inc.
461 description: Inverse Path
463 description: Iomega Corporation
465 description: ISEE 2007 S.L.
467 description: Intersil
469 description: Integrated Silicon Solutions Inc.
471 description: ITEAD Intelligent Systems Co.Ltd
473 description: iWave Systems Technologies Pvt. Ltd.
475 description: Japan Display Inc.
477 description: JEDEC Solid State Technology Association
479 description: Shenzhen Jesurun Electronics Business Dept.
481 description: Jiandangjing Technology Co., Ltd.
483 description: Ka-Ro electronics GmbH
485 description: Keith & Koep GmbH
487 description: Keymile GmbH
491 description: Kieback & Peter GmbH
493 description: Kinetic Technologies
495 description: King & Display Technology Co., Ltd.
497 description: Kingnovel Technology Co., Ltd.
499 description: Kionix, Inc.
501 description: Rakuten Kobo Inc.
503 description: Kaohsiung Opto-Electronics Inc.
505 description: Kontron S&T AG
507 description: Sutajio Ko-Usagi PTE Ltd.
509 description: Kyocera Corporation
513 description: Laird PLC
515 description: Ketai Huajie Technology Co., Ltd.
517 description: Lantiq Semiconductor
519 description: Lattice Semiconductor
521 description: Shenzhen Leadtek Technology Co., Ltd.
525 description: LEGO Systems A/S
527 description: Shenzhen LeMaker Technology Co., Ltd.
529 description: Lenovo Group Ltd.
531 description: LG Corporation
533 description: LG Display
535 description: Shenzhen Libre Technology Co., Ltd
537 description: Lichee Pi
539 description: Linaro Limited
541 description: LinkSprite Technologies, Inc.
543 description: Belkin International, Inc. (Linksys)
545 description: Linux-specific binding
547 description: Linx Technologies
549 description: Linear Technology Corporation
551 description: Logic PD, Inc.
553 description: Logic Technologies Limited
555 description: Longcheer Technology (Shanghai) Co., Ltd.
557 description: LSI Corp. (LSI Logic)
559 description: Liebherr-Werk Nenzing GmbH
561 description: Macnica Americas
563 description: Mapleboard.org
565 description: Marvell Technology Group Ltd.
567 description: MaxBotix Inc.
569 description: Maxim Integrated Products
571 description: Mobiveil Inc.
575 description: Measurement Specialties
577 description: Mustek Limited
579 description: MediaTek Inc.
581 description: MegaChips
583 description: Shenzhen MeLE Digital Technology Ltd.
585 description: Melexis N.V.
587 description: MELFAS Inc.
589 description: Mellanox Technologies
591 description: MEMSIC Inc.
593 description: Menlo Systems GmbH
595 description: Merrii Technology Co., Ltd.
597 description: Micrel Inc.
599 description: Microchip Technology Inc.
601 description: Micro Crystal AG
603 description: Micron Technology Inc.
605 description: Microsoft Corporation
607 description: MikroElektronika d.o.o.
609 description: Miniand Tech
611 description: MINIX Technology Ltd.
613 description: MiraMEMS Sensing Technology Co., Ltd.
615 description: Mitsubishi Electric Corporation
617 description: Mosaix Technologies, Inc.
619 description: Motorola, Inc.
621 description: Moxa Inc.
625 description: mqmaker Inc.
627 description: Microsemi Corporation
629 description: Micro-Star International Co. Ltd.
631 description: Imagination Technologies Ltd. (formerly MIPS Technologies Inc.)
633 description: Multi-Inno Technology Co.,Ltd
635 description: Mundo Reader S.L.
637 description: Murata Manufacturing Co., Ltd.
639 description: Macronix International Co., Ltd.
641 description: MYIR Tech Limited
643 description: National Semiconductor
645 description: NEC LCD Technologies, Ltd.
647 description: Neonode Inc.
651 description: Broadcom Corporation (formerly NetLogic Microsystems)
653 description: Netron DY
655 description: Shenzhen Netxeon Technology CO., LTD
659 description: Next Thing Co.
661 description: Newhaven Display International
663 description: National Instruments
665 description: Nintendo
667 description: NLT Technologies, Ltd.
671 description: Nordic Semiconductor
673 description: NovTech, Inc.
675 description: NutsBoard
677 description: Nuvoton Technology Corporation
679 description: New Vision Display
683 description: NXP Semiconductors
685 description: Oceanic Systems (UK) Ltd.
687 description: Okaya Electric America, Inc.
689 description: Oki Electric Industry Co., Ltd.
691 description: OLIMEX Ltd.
693 description: One Laptop Per Child
695 description: Onion Corporation
697 description: ON Semiconductor Corp.
699 description: On Tat Industrial Company
701 description: Opal Kelly Incorporated
703 description: OpenCores.org
705 description: OpenRISC.io
707 description: Option NV
709 description: Shenzhen Oranth Technology Co., Ltd.
711 description: Oracle Corporation
713 description: Orise Technology
715 description: Ortus Technology Co., Ltd.
717 description: OSD Displays
719 description: Overkiz SAS
721 description: OmniVision Technologies
723 description: Oxford Semiconductor, Ltd.
725 description: Panasonic Corporation
727 description: Parade Technologies Inc.
729 description: Precision Design Associates, Inc.
731 description: Pericom Technology Inc.
733 description: Pervasive Displays, Inc.
735 description: PHICOMM Co., Ltd.
737 description: PHYTEC Messtechnik GmbH
739 description: Picochip Ltd
743 description: Shenzhen PineRiver Designs Co., Ltd.
745 description: PIXCIR MICROELECTRONICS Co., Ltd
747 description: Plantower Co., Ltd
749 description: Plat\'Home Co., Ltd.
753 description: Broadcom Corporation (formerly PLX Technology)
755 description: PNI Sensor Corporation
757 description: Polaroid Corporation
759 description: Portwell Inc.
761 description: Poslab Technology Co., Ltd.
763 description: Point of View International B.V.
765 description: PowerVR (deprecated, use img)
767 description: Primux Trading, S.L.
769 description: PROBOX2 (by W2COMP Co., Ltd.)
771 description: PulsedLight, Inc
773 description: Purism, SPC
775 description: Qualcomm Atheros, Inc.
777 description: Qualcomm Technologies, Inc
779 description: QEMU, a generic and open source machine emulator and virtualizer
781 description: Qi Hardware
783 description: Chengdu Kaixuan Information Technology Co., Ltd.
785 description: QiaoDian XianShi Corporation
787 description: QNAP Systems, Inc.
791 description: RaidSonic Technology GmbH
793 description: Mediatek/Ralink Technology Corp.
795 description: Ramtron International
797 description: Raspberry Pi Foundation
799 description: Raydium Semiconductor Corp.
801 description: Unisoc Communications, Inc.
803 description: Realtek Semiconductor Corp.
805 description: Renesas Electronics Corporation
807 description: Shenzhen Rervision Technology Co., Ltd.
809 description: Richtek Technology Corporation
811 description: Ricoh Co. Ltd.
813 description: Rikomagic Tech Corp. Ltd
815 description: RISC-V Foundation
817 description: Fuzhou Rockchip Electronics Co., Ltd
819 description: ROCKTECH DISPLAYS LIMITED
821 description: ROHM Semiconductor Co., Ltd
823 description: Ronbo Electronics
825 description: Shenzhen Roofull Technology Co, Ltd
827 description: Samsung Semiconductor
829 description: Samtec/Softing company
831 description: Sancloud Ltd
833 description: Sandisk Corporation
835 description: Satoz International Co., Ltd
837 description: Smart Battery System
839 description: Schindler
841 description: Seagate Technology PLC
843 description: Shenzhen SEI Robotics Co., Ltd
845 description: Semtech Corporation
847 description: Sensirion AG
849 description: Sensortek Technology Corporation
851 description: Small Form Factor Committee
853 description: Solomon Goldentek Display Corporation
855 description: SGX Sensortech
857 description: Sharp Corporation
859 description: Shimafuji Electric, Inc.
861 description: Si-En Technology Ltd.
863 description: Silicon Linux Corporation
865 description: SiFive, Inc.
867 description: Sigma Designs, Inc.
869 description: Seiko Instruments, Inc.
871 description: Silicon Image
873 description: Silicon Laboratories
875 description: Silead Inc.
877 description: Silergy Corp.
879 description: Silicon Mitus, Inc.
881 description: Cypress Semiconductor Corporation (Simtek Corporation)
883 description: Sinlinx Electronics Technology Co., LTD
885 description: SinoVoip Co., Ltd
887 description: Shenzhen Sipeed Technology Co., Ltd.
889 description: SiRF Technology, Inc.
891 description: Silicon Integrated Systems Corp.
893 description: Sitronix Technology Corporation
895 description: Skyworks Solutions, Inc.
897 description: Standard Microsystems Corporation
899 description: Synopsys, Inc.
901 description: Shenzhen SoChip Technology Co., Ltd.
903 description: Socionext Inc.
905 description: SolidRun
907 description: Solomon Systech Limited
909 description: Sony Corporation
911 description: Spansion Inc.
913 description: Spreadtrum Communications Inc.
915 description: Silicon Storage Technology, Inc.
917 description: STMicroelectronics
919 description: Starry Electronic Technology (ShenZhen) Co., LTD
923 description: ST-Ericsson
925 description: ST-Ericsson
927 description: Summit microelectronics
929 description: Shenzhen Sunchip Technology Co., Ltd
931 description: Sun Microsystems, Inc
933 description: Sierra Wireless
935 description: Synaptics Inc.
937 description: Synology, Inc.
939 description: TBS Technologies
940 "^tbs-biometrics,.*":
941 description: Touchless Biometric Systems AG
943 description: Trusted Computing Group
945 description: Toby Churchill Ltd.
947 description: TechNexion
949 description: Technologic Systems
951 description: Tempo Semiconductor
953 description: Shenzhen Techstar Electronics Co., Ltd.
955 description: Terasic Inc.
957 description: Three Five Corp
959 description: THine Electronics, Inc.
961 description: Texas Instruments
963 description: Tianma Micro-electronics Co., Ltd.
965 description: Trusted Logic Mobility
967 description: Tecon Microprocessor Technologies, LLC.
971 description: TPO (deprecated, use tpo)
974 description: Toradex AG
976 description: Toshiba Corporation
980 description: TPK U.S.A. LLC
982 description: TP-LINK Technologies Co., Ltd.
986 description: TQ Systems GmbH
990 description: Tronsmart
992 description: Truly Semiconductors Limited
994 description: Theobroma Systems Design und Consulting GmbH
996 description: Tyan Computer Corporation
1000 description: uCRobotics
1002 description: Ubiquiti Networks
1006 description: Ugoos Industrial Co., Ltd.
1008 description: United Western Technologies Corp (UniWest)
1010 description: uPI Semiconductor Corp.
1012 description: United Radiant Technology Corporation
1014 description: Universal Scientific Industrial Co., Ltd.
1016 description: Aigo Digital Technology Co., Ltd.
1018 description: V3 Semiconductor
1020 description: Vamrs Ltd.
1022 description: Variscite Ltd.
1024 description: VIA Technologies, Inc.
1026 description: Virtual I/O Device Specification, developed by the OASIS consortium
1028 description: Vishay Intertechnology, Inc
1030 description: Vitesse Semiconductor Corporation
1032 description: Vivante Corporation
1034 description: VoCore Studio
1036 description: Voipac Technologies s.r.o.
1038 description: Vision Optical Technology Co., Ltd.
1040 description: VXT Ltd
1042 description: Western Digital Corp.
1044 description: WeTek Electronics, limited.
1048 description: Shenzhen whwave Electronics, Inc.
1050 description: Wi2Wi, Inc.
1052 description: Winbond Electronics corp.
1054 description: Winstar Display Corp.
1056 description: Shenzhen Merrii Technology Co., Ltd. (WITS)
1058 description: Wolfson Microelectronics
1060 description: Wondermedia Technologies, Inc.
1064 description: X-Powers
1066 description: Extreme Engineering Solutions (X-ES)
1068 description: Xillybus Ltd.
1070 description: Shenzhen Xinpeng Technology Co., Ltd
1074 description: Shenzhen Xunlong Software CO.,Limited
1075 "^yones-toptech,.*":
1076 description: Yones Toptech Co., Ltd.
1078 description: Y Soft Corporation a.s.
1080 description: Zarlink Semiconductor
1082 description: ZEITEC Semiconductor Co., LTD.
1084 description: Shenzhen Zidoo Technology Co., Ltd.
1086 description: Zodiac Inflight Innovations
1088 description: ZTE Corp.
1090 description: ZyXEL Communications Corp.
1092 # Normal property name match without a comma
1093 # These should catch all node/property names without a prefix
1094 "^[a-zA-Z0-9#_][a-zA-Z0-9+\\-._@]{0,63}$": true
1095 "^[a-zA-Z0-9+\\-._]*@[0-9a-zA-Z,]*$": true
1098 additionalProperties: false